Jefferies on copper foil, a potential upstream bottleneck as PCB shortages intensify: "AI PCB/CCL. driven by tech giants' rising capex plans on AI infra buildout, this trend has also brought structural changes to electrolytic copper foil as one of key upstream. The global AI Server Copper Foil market is projected to grow from US$ 38. 87 million by 2031, at a CAGR of 6. 4% (2025-2031), driven by critical product segments and diverse end‑use applications, while evolving U. 2% CAGR during the forecast period (2025-2031). In this report, we will assess the current U. tariff framework alongside international policy adaptations, analyzing their. Huxiu says AI servers are shifting copper foil demand toward verified HVLP4 supply, with Tongguan and Defu among A-share names to watch. According to Hankyung, citing sources, a Seoul-based PCB maker placed advance orders worth KRW 10 billion with Taiwan's EMC and TUC—more than five times its typical monthly. As manufacturers strive to minimize signal loss in high-frequency environments, the demand for specialized AI Copper Foil is gaining significant traction.
